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Broadcom, Toppan open Singapore's first advanced chip substrate facility

SINGAPORE -- U.S. chipmaker Broadcom and Japan's Toppan Holdings opened Singapore's first advanced chip substrate plant months ahead of schedule on Tu

By CHENG TING-FANGNikkei Asia Tech
Broadcom, Toppan open Singapore's first advanced chip substrate facility

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Originally published by Nikkei Asia Tech on Sep 29, 2026.

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