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Japan’s Sumitomo Bakelite expands China chip packaging materials output amid AI boom

Japanese semiconductor materials giant Sumitomo Bakelite plans to expand production of advanced chip packaging materials in China and Singapore, marking the second such announcement for its Chinese operations in less than four months as artificial intelligence drives demand for more sophisticated…

By Howard LiuSouth China Morning Post Tech
Japan’s Sumitomo Bakelite expands China chip packaging materials output amid AI boom

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Originally published by South China Morning Post Tech on Oct 11, 2026.

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