40 stories
Benchmark Electronics combines engineering expertise, workforce development, and flexible production to expand high-mix electronics manufacturing across Thailand. The post Benchmark Electronics’ Thailand Operations Focus on High-Mix Manufacturing appeared first on EE Times.
At Ayar Labs CPO Summit, Meta, Broadcom, AMD, and others weighed in on readiness for a 2028 co-packaged optics demand surge and the OCI MSA’s role. The post Co-Packaged Optics Moves from Promise to Production Planning appeared first on EE Times.
Explore VICFUSE's Class CF fuse line, which offers current-limiting technology and meets Class J performance standards in a compact design. The post VICFUSE UL Standard Class Series Fuse Holders: Quality, Reliability, and Industrial Protection appeared first on EE Times.
Discover how Taiwan Innotech Expo 2026 showcased AI solutions designed to advance industries with practical, real-world impact The post TIE Showcases Taiwan’s Push to Deploy AI Across Industries appeared first on EE Times.
In a bid to secure domestic deep-tech infrastructure, Qilimanjaro closed €19.6 million (~$21.3 million) funding led by Indra Group. The post Spain’s Indra Bets on Qilimanjaro Quantum for Sovereign Deep Tech appeared first on EE Times.
See how Amperesand’s solid-state transformers aim to tame AI data center power spikes with batteries, 800 VDC conversion, and microgrid control. The post Amperesand Aims to Smooth AI Data Center Power Spikes appeared first on EE Times.
CASPA’s annual conference celebrates its 35th anniversary with a lineup of more than 35 CEOs from Silicon Valley, including Intel’s Lip-Bu Tan and Cerebras’s Andrew Feldman. The post CASPA CEO Summit Preview with President Jimmy Cheng appeared first on EE Times.
Honya Europe's Robert Tarantowicz shares 17 years of lessons on PCB sourcing in China, quality, trust, and risk management. The post 17 Years with China: What Really Makes a Partnership Work appeared first on EE Times.
Join this webinar and learn how to add LCD graphics to MCU projects without a display controller, accelerator, or external DRAM. The post Embedded Graphics on an MCU – Without an Accelerator appeared first on EE Times.
Consumer, industrial, networking, semiconductor, and software manufacturers face a broad product-cybersecurity regulation for the first time. The post EU CRA Readiness: 5 Steps Manufacturers Need to Take Now appeared first on EE Times.
Manufacturing partnerships and public sector funding are moving Xanadu’s quantum technology toward manufacturable, utility-scale systems. The post Xanadu Builds Out Canadian Quantum Infrastructure appeared first on EE Times.
GlobalFoundries said strained-silicon FD-SOI can deliver 7-nm-class performance without EUV and open a new market for Europe. The post Manfred Horstmann: GlobalFoundries Bets on FDX Fusion for Physical AI appeared first on EE Times.
Join our expert-led webinar to explore Infineon's comprehensive portfolio for Solid-State Transformers (SSTs). The post Solid-State Transformers: Accelerate Your SST Design appeared first on EE Times.
Join this BitCast and explore how extending NoC connectivity across die boundaries enables engineering teams to scale from monolithic SoCs to multi-die architectures. The post Connecting Chiplets Isn’t Enough – Solving the Data Movement Challenge in Multi-Die Systems appeared first on EE Times.
Join this webinar, where our expert will explore the technology behind the ADMT4000 and how its ability to track multiple rotations and angular movement without power is transforming the design of both linear and rotary actuators.
Join us to discover how Siemens Innovator3D IC streamlines 3D IC design from planning to implementation! The post Scaling 3D IC design: Trends, Challenges and Practical Workflows appeared first on EE Times.
Register now for our webinar to discover how Navitas 2.0 is revolutionizing AI infrastructure power delivery. The post Breaking the AI Infrastructure Power Wall: From Grid to xPU appeared first on EE Times.
See how Synopsys uses agentic AI to orchestrate trusted EDA tools for precise, explainable chip design, and faster engineering workflows. The post Can AI Be Trusted? Synopsys on Agentic AI and Autonomous Engineering appeared first on EE Times.
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