74 stories
AMD is pursuing a 'broader partnership' with Samsung as memory company wants to tie advanced memory supply to its orders at its foundry unit.
AI demand fattens chipmakers' margins while cheaper PCs and phones become harder to produce profitably
Two former Groq engineers sued Groq’s board in Delaware over the Nvidia licensing deal behind the Groq 3 LPU.
TSMC, which supplies Nvidia and Apple, had forecast quarterly revenue of US$44.6 billion to US$45.8 billion.
Rohm Semiconductor retains wafer fabrication in-house as it expands its back-end semiconductor operations and R&D footprint in India. The post Rohm Semiconductor Expands Back-End Chip Manufacturing Outsourcing appeared first on EE Times.
For AMD CTO Mark Papermaster, tailored computing and holistic design are key to delivering AI. The post AMD’s Mark Papermaster: Exclusive Video Interview at World Summit AI appeared first on EE Times.
Qualcomm will license patents behind Huawei’s LogicFolding, according to one report, as a teardown shows off the Kirin 9050 Pro’s two dies.
Samsung is expanding shipments of HBM4 chips, narrowing the gap with SK hynix.
TOKYO -- Japanese chip equipment maker Tokyo Electron's operating profit is likely to grow about 60% to reach a record 1 trillion yen ($6.3 billion) f
Seattle-based Chiplytics raised $4.5 million and opened an East Coast inspection facility to help manufacturers catch fake or defective semiconductor chips and other electronics. The startup uses AI and robotics to test every individual component rather than relying on spot checks. Read More
CSET’s Jacob Feldgoise, Kyle Miller, and Hanna Dohmen dove deep into investigating how location verification methods can—and cannot—improve enforcement of export controls on powerful AI chips, culminating in their report.
Huawei and Qualcomm sign a multi-year patent cross-license covering 5G and AI, with Qualcomm buying some Huawei US patents.
Everspin’s demo shows how a 4-GB pool of persistent MRAM can serve as a new tier of storage between DRAM and NAND flash. The post CXL-Connected MRAM Address AI Storage Latency appeared first on EE Times.
The case alleges that the licensing deal "squeezed out" stockholders by giving them a "lowball price."
OpenAI’s own AI models changed parts of its Jalapeño chip, and its engineers could not always say why. In one example, they saved more than 13% of die area, Richard Ho told Ian Cutress of More Than Moore. Ho leads OpenAI’s hardware team, and the interview was published on 30 September.
Synopsys joins OpenAI for a leap of faith in AI-native IC design by augmenting frontier models with EDA tools. The post GPT-Synopsys Combines IC Design EDA with Agentic AI appeared first on EE Times.
Centre for Technology & Statecraft (CTS) calls for banning exports of all immersion DUV tools to China, echoes the MATCH Act by U.S. legislators.
ZNTC completes development of Russia's first 130nm-capable lithography stepper, which could be used to produce chips sometimes late this decade, or rather early next.
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